发明名称 FUNCTIONAL FILM AND PROCESS FOR ITS PRODUCTION
摘要 <p>A functional film comprising a thermoplastic resin substrate having formed thereon a coating layer and a process for its production. The functional film has various improved properties such as heat resistance and is inexpensive and of general-purpose use. This film is produced by baking a thin film of phenol resin, epoxy resin, silicone resin or the like on a thermoplastic resin substrate, and can be utilized as flexible printed wiring board, insulating tape, etc.</p>
申请公布号 WO1988002761(P1) 申请公布日期 1988.04.21
申请号 JP1987000761 申请日期 1987.10.08
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