发明名称 JIG FOR CARRYING WAFER
摘要 <p>PURPOSE:To prevent trouble, in which a wafer is easy to be damaged by bending moment and deflection is generated by forming a notch starting section on the center side of an silica glass tube and a section near the notch starting section in thickness thicker than other sections. CONSTITUTION:With a jig 1, a notch is started to an arcuate shape in a section near the center of a cylindrical body made of silica glass such as a section (a notch starting section) 2 in approximately one third from one end, and a wafer boat holding section 3 is shaped by a notch parallel with a shaft continuing to the notch. A thick layer 4 made thicker than the wall thickness of other sections is shaped near the arcuate notch starting section 2, and the thick layer is reinforced in thickness of approximately treble as thick as the thickness of other sections, but the thick layer is practically selected normally from the range of approximately 1.8-3.5 times. A cylindrical reinforcing end section 5 for the jig 1 is set up firmly to a moving operating member 7 for a wafer conveyor 6, a boat 9 on which wafers 8 are placed separately is put onto the holding section 3 for the jig, the member 7 is shifted straightly in the axial direction, the boat 9 is inserted from a heat-treating furnace carry-in port 30, and lowered slowly into a furnace and the member 7 is drawn out, leaving the boat.</p>
申请公布号 JPS64734(A) 申请公布日期 1989.01.05
申请号 JP19880129264 申请日期 1988.05.26
申请人 SHINETSU SEKIEI KK 发明人 FUKUOKA TOSHITO;NAKAMURA KAZUO
分类号 H01L21/677;H01L21/22;H01L21/673;H01L21/68 主分类号 H01L21/677
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