| 摘要 |
PURPOSE:To be able to mount an integrated circuit of high power with multiple pins in a structure having excellent heat sink effect in simple manufacturing steps by forming a structure that the lead frames of the circuit is mounted in a ceramic package having a heat sink used as an external connection terminal. CONSTITUTION:An integrated circuit 4 cut in advance in a predetermined shape, a ceramic package 1 having in advance a heat dissipating heat sink 2, placing the circuit 4 and having a lead frame 3 for external connection of the circuit 4, and a ceramic plate for hermetically sealing by a sealing material 6 the package 1 are provided. For example, the circuit 4 of tape carrier type cut with the lead frame 3 is secured by soldering to the package 1, and the plate 5 is further hermetically sealed by mounting the glass sealing material 6. The frame 3 is externally led through a sealer to form an external connection terminal. The package 1 is attached to a circuit substrate 8 through a buffer 7, such as epoxy resin. |
