发明名称 |
Method of producing multilayer printed-wiring board containing metal core. |
摘要 |
<p>Disclosed is a method of producing a multilayer printed-wiring board containing at least a metal plate (1) as an inner layer plate. The method comprises the steps of: forming as the metal plate a metal plate having a peripheral portion (3) which is a non-product portion, and a product portion (2) surrounded by the non-product portion, the peripheral portion (3) and the product portion (2) being partially connected; filling an insulating material (10) in non-connecting portions (16) formed between the peripheral portion and the product portion; laminating the metal plate (1) with another inner layer plates to form a multilayer body (20); and separating the peripheral portion from the product portion within the regions (16) in which the insulating material (10) is filled.</p> |
申请公布号 |
EP0264105(A2) |
申请公布日期 |
1988.04.20 |
申请号 |
EP19870114945 |
申请日期 |
1987.10.13 |
申请人 |
HITACHI, LTD. |
发明人 |
IMAHASHI, FUMIO;SHIRASAWA, HISATO;KAWAGUCHI, MASAMI;SENGOKU, NORIO;IMAI, TSUTOMU |
分类号 |
H05K3/00;H05K3/44;H05K3/46 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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