| 摘要 |
A substrate (3) having conductive wirings (1) carries at least one electronic component (4), such as an IC chip, having a plurality of leads connected (5) to said conductive wirings.�A fluid silicone material (11, 21) is provided on said substrate at least to fill the space beneath said leads or even to completely embed the leads. A hardened s ilicone material (12, 22) is provided to cover said fluid silicone material. |
