| 摘要 |
PURPOSE:To improve reliability on moisture resistance by mounting a chip in which the wiring of a metallic thin-film having a fuse function is formed onto one main surface of a semiconductor substrate through an insulating film, a stud electrode arranged, holding the chip and a glass sealing body sealing these chip and stud electrode. CONSTITUTION:A chip 10 is guided into a glass tube 13, held by a pair of stud electrodes 11, 12 from both surfaces, and the inner surface of the glass tube 13 and each side surface of the stud electrodes 11, 12 are heated and sealed, thus acquiring a glass seal type semiconductor-element protective device. 14 and 15 represent external electrodes, and each one end is connected to the stud electrodes 11, 12. |
