HEAT DISSIPATION FOR ELECTRONIC COMPONENTS ON CERAMIC SUBSTRATE

摘要

Disclosed is a heat dissipator for electronic components on a ceramic substrate. The ceramic plate receives heat from the component at one sur-face and has a plurality of separate spaced metallic heat-conducting elements mounted on and extending from the other surface of the plate In a preferred embodiment the ceramic plate on which the metallic elements are mounted is separate from a ceramic substrate on which the electronic components are mounted; the ceramic plate carrying the metallic elements includes adhesive for adhering it to the ceramic substrate carrying the electronic components; the metallic elements are cylindrical copper pins; and the pins are connected to the ceramic plate via solder and metallic pads deposited on the ceramic plate.