| 摘要 |
PURPOSE:To achieve highly reliable wire bonding and obtain a wider bonding area by a method wherein a capillary is held by a bonding arm which is pro vided vertically on a surface to be bonded and an ultrasonic piezoelectric trans ducer is provided near the capillary. CONSTITUTION:A bonding arm 6 which holds a capillary 1 is provided vertically to a surface to be bonded and an ultrasonic piezoelectric transducer 7 which makes the capillary 1 vibrate is provided near the capillary 1. First, the tip of a wire 5 is protruded from the center hole at the bottom end of the capillary 1 and a ball 9 is formed at the tip by an electric torch and then the bonding arm 6 is made to descend. At the same time as the ball 9 at the tip is pressed against 1st bonding point, a radio frequency voltage is applied to the ultrasonic piezoelectric transducer 7 to apply ultrasonic vibration to the capillary 1. With this constitution, strong bonding can be achieved and a wider bonding area can be obtained. |
