| 摘要 |
PURPOSE:To prevent circuit erosion by the invasion of plating solution for cracks and obtain a highly reliable multilayer wiring board in which acid proof is improved by interposing a resin impregnated base material between the upper and the lower faces so as to integrally form an outer layer material, and making 85-90% of the degree of cure of therein after the integration to drill. CONSTITUTION:Circuits 2 comprising metal foils such as copper are provided on the upper and the lower faces of an inner layer material 1 and resin impregnated base material 3 are arranged on the upper and the lower faces thereof. At this time, for example, the degree of cure of resin is made 85-90% after resin 5 such as epoxy resin and polyimide resin impregnated into a base material 4 comprising glass cloth, glass mat, paper and the like is arranged and integrated. After it is performed in the above way, it is drilled, but the impact at the time of drilling by the use of a drill and the like by making 85-90% of the degree of cure of resin is relaxed by the resin and peeling-off of the circuit part and the resin impregnated base material 3 and the occurrence of cracks are prevented. Thereby circuit erosion by the invasion of plating solution is controlled remarkably and a highly reliable multilayer wiring board can be obtained. |
