发明名称 |
Device for adjusting pressure loss of cooling air for an assembly of cards carrying electronic components |
摘要 |
In a cooling structure for electronic apparatus in which cards consisting of electronic components mounted on circuit boards are arranged in parallel on a motherboard. A pressure adjustment device with holes is arranged in a cooling air flow passage of each card. The area of the holes is selected in relation to the pressure loss characteristics of the related card based upon average air-flow sectional area.
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申请公布号 |
US4739444(A) |
申请公布日期 |
1988.04.19 |
申请号 |
US19860835764 |
申请日期 |
1986.03.03 |
申请人 |
HITACHI LTD;HITACHI MICROCUMPUTER ENG |
发明人 |
ZUSHI, SHIZUO;OGATA, TETSUO;MIYAMOTO, MITSUO;IMAI, TSUTOMU;KOBAYASHI, FUMIYUKI |
分类号 |
H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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