| 摘要 |
PURPOSE:To prevent any edge shortcircuit from occuring by a method wherein leads are projectingly provided on a hole part for mounting a semiconductor chip thereon to be connected to electrode pads of a semiconductor chip while the leads excluding the connecting parts to the electrode pads are covered with heat resistant insulators. CONSTITUTION:The bases of leads 9 are made into circuit patterns on a film carrier 1 while the ends of leads 9 as connecting parts to electrode pads 11 of a semiconductor chip 3 projectingly face on a hole part 8. Heat resistant insulators such as polyimide films 13 are formed on the periphery of intermediate part of leads 9. The films 13 are coated in several mum thickness by e.g. printing or immersion process. When the film carrier 1 is junctioned with the semiconductor chip 3, the electrode pads 11 are brought into contact with the ends of leads 9 only to electrically insulate the intermediate part of leads 9 from the edges of semiconductor chip 3 by the films 13. Through these procedures, even if the semiconductor chip 3 is inclined during the junctioning process, the edges of semiconductor chip 3 and the leads 9 can be prevented from coming into contact with one another. |
