| 摘要 |
PURPOSE:To enable avoiding the charging of static electricity on a semiconductor wafer by coating an insulating film on the surface of a wafer chuck and by coating a conductive film on part of a surface which attracts the wafer. CONSTITUTION:A Teflon film 13 as an insulating film is applied on the periphery and the side of the surface which attracts a wafer of a wafer chuck 11 which has grooves 12 on the surface and is made of Al. An Al film 14 as a conductive film is applied at the center of the surface which attracts the wafer. Since the Al film 14 is applied on the surface which attracts the wafer, the static electricity charged on the wafer is conducted from the Al film 14 through the wafer chuck 11 and a setscrew 15 to the shaft 17 of a motor 16 and the charging on the wafer can be avoided. |
