| 摘要 |
PURPOSE:To mount in high density and to reduce the size of a thick film IC by placing a flip-chip on a thick film substrate, bonding a wire junction IC chip, a beam lead IC chip to the rear surface, and then connecting them to the thick film circuit substrate. CONSTITUTION:A solder electrode 15 of a flip-chip IC 14 is soldered onto a thick film circuit substrate 19. An equal size or larger wire junction IC 11 is bonded at 13 with Ag paste to the rear surface. Then, the substrate 19 is wire bonded at 12 to the IC 11. Further, it is covered with a protective film 18 as required. Semiconductor chips can be mounted in high density on the substrate by this stereoscopic mounting structure to reduce the thick film IC. |
