| 摘要 |
<p>PURPOSE:To attain supermulti-electrode constitution, and to inhibit a potential drop and noises, etc., by forming an external electrode for soldered joint at the central section of the main surface of an integrated circuit chip and an external electrode for connecting a TAB lead to a peripheral section. CONSTITUTION:External electrodes 4 for soldered joint are shaped at the central section of the main surface of an integrated circuit 1 and external electrodes 2, 3 for connecting TAB leads to a peripheral section. The electrical test of a wafer level is executed by bringing a testing probe into contact with the electrodes 2, 3 for the circuit 1 in the circuit 1. The electrodes disposed at the central section of the main surface of the circuit 1 can also be employed under the state of actual usage, thus inhibiting a potential drop and noises, etc. Accordingly, supermulti-electrode structure is attained.</p> |
