| 摘要 |
<p>PURPOSE:To easily and accurately position a semiconductor chip thereby to simplify a bonding operation by chucking the chip by turning a chucking stand and wire bonding the chip without rotating it. CONSTITUTION:A semiconductor chip 2 is set in a package 1, conveyed at A by a carrier 9, and arrived at a chuck stand 3. The stand 3 is raised at B, abutted on the package, attracted in a vacuum, the package is held at a home position, and a pad 4 in a junction region of a bonder 10 is wire bonded to an electrode. The stand 3 is moved down, the attraction is released, the package is fed at a predetermined pitch P, and the pad 4 is disposed under the bonder. Then, the stand 3 is rotated at 180 deg. along the lower surface of the package. The stand 3 is raised to chuck the package 1, and the wire bonding is executed in the same operation as described above. Thus, since the wire bonding of all the pads 4 at both longitudinal ends of the chip 2 is finished, the chip 2 is conveyed together with the package by the down movement of the stand 3, and a new package is conveyed.</p> |
