| 摘要 |
<p>PURPOSE:To simplify and facilitate a carrying operation and to improve space efficiency, by rotating a holding means which is rotatably installed on boundary parts among a plurality of processing chambers and by moving a material to be processed from the first processing chamber to the second processing chamber while it is being held on a holding means. CONSTITUTION:A semiconductor wafer 4 is carried into a load . unload locking chamber 3 and housed into a wafer cassette 5, and it is held by a carrying-in and carrying-out mechanism 18 and fitted to a wafer fitting member 16 on a side of a wafer stage 15 inside the chamber 7 so that it is held in a vertical state. In this state, an etching process is performed for the wafer 4. Successively, when the wafer stage 15 is rotated by 180 degrees around its vertical directional central line, the wafer 4 is moved from the position shown in real lines in a figure toward the position shown in alternate long and two dashes lines in the figure and held in the chamber 8. An etching process is performed for the wafer 4 in this state. Successively, the wafer 4 is disassembled from the wafer stage 15 and housed into the wafer cassette 6 and moreover carried from the chamber 3 to the next process.</p> |
