发明名称 ELECTRONIC DEVICE
摘要 PURPOSE:To prevent the generation of a crack in a resin seal type package by forming a chamfering section to the outer periphery of a tab as the mounting section of a pellet resin-sealed to the package to a downward contracting shape. CONSTITUTION:A chamfering section 10 is shaped at the same time as the stamping of a tab 8 by previously inclining an edge for a press die punching the tab 8 at a fixed angle. Since the chamfering section 10 is formed at the outer periphery of the tab 8, no crack is generated in a package 14. That is, even when peeling is generated on the interface of the lower surface of the tab and the package or the tab and a pellet by repeated stress by thermal stress, stress is dispersed and is not concentrated because the chamfering section 10 is shaped at the outer periphery of the tap 8, thus preventing the working of excess stress to the peeling section, then obviating a phenomenon in which a crack is generated from the peeling section. The stress is dispersed most excellently when the inclination theta of the chamfering section 10 is set at approximately 45 deg..
申请公布号 JPS6381965(A) 申请公布日期 1988.04.12
申请号 JP19860225951 申请日期 1986.09.26
申请人 HITACHI LTD 发明人 OHASHI WATARU;NOZAWA FUMIHARU;TSUYA HIDEKI
分类号 H01L23/50;H01L23/28 主分类号 H01L23/50
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