摘要 |
PURPOSE:To provide a heat-resistant resin composition having excellent moisture resistance and composed of an epoxy compound and a reaction product of an N,N'-bisimide compound of an unsaturated carboxylic acid and an aminophenol and/or aniline (derivative). CONSTITUTION:The objective resin composition can be produced by reacting (A) an N,N'-bisimide compound of an unsaturated dicarboxylic acid of formula I (R<1> is >=2C bivalent group; R<2> is bivalent group containing C=C) with (B) an aminophenol of formula II (R<3> is H, halogen or alkyl) and (C) an aniline (derivative) of formula III (R<4> and R<5> are H or a group free from active H, e.g. alkyl, halogen, OCH3, OC2H5, etc.) and compounding the reaction product with (D) an epoxy compound containing >=2 epoxy groups in a molecule. The sum of the components B and C is 0.1-1mol per 1mol of the component A and that of the component B is preferably 0.2-2 equivalent per 1mol of the component A. The amount of the component D is >=1 equivalent based on 1mol of 2B+C. |