| 摘要 |
PURPOSE:To determine correctly positioning of a photodetector with respect to a laser chip and improve operation efficiency by preparing a positioning mark corresponding to the photodetector on a plane arranged by inclining over space between a plane equipped with a carrier block where the photodetector is mounted and a plane visible in the case of incorporating a package. CONSTITUTION:At a region extending from a plane 4 equipped with a chip carrier 2 to a detectable plane 3 through a slope 5; for instance, metallized layers of gold 6 and 7 are prepared and a part of the mounted plane 4 of one layer 6 composes a broad and rectangular pad 8 which is equiped with a photodetector 1 and the part of the mounted plane 4 of other layer 7 composes a wire bonding pad 9. And then, a mark 13 for determining positioning is formed at a slope 5 by the metallized layer simultaneously with the formation of layers 6 and 7 so that the center of a light receiving plane of the photodetector 1 can be indicated by the center of cross. When a semiconductor laser device is assembled, especially, the chip carrier 2 is fixed to a stem 15 with solder, its chip carrier 2 is fixed to the stem 15 so that positioning in the longitudinal direction of the carrier chip 2 intersecting at right angles to a laser light 35 coming from a laser diode chip 22 of photodetector makes detected solder positions of the mark 13 coincide with each other. |
