发明名称 BONDING TOOL
摘要 PURPOSE:To mount a bonding tool at the prescribed position of a bonding arm by forming a projecting section for specifying a position to the bonding arm to the bonding tool. CONSTITUTION:A capillary 1 (a bonding tool) has a cylindrical capillary body 2 made of a substance such as ceramics, a collar-shaped projecting section 3 projected in the direction vertical to the central axis of the capillary body 2, a rotation stopping section 5 for preventing the revolution of the capillary 1 when the capillary 1 is set up to a bonding arm 4, and a through-hole 7 for inserting a bonding wire 6. In this example, a recessed section 8 fitted to the collar-shaped projecting section in the capillary 3 is formed at the nose section of the bonding arm 4, and the capillary 1 can be brought into contact vertically with a body to be bonded (such as an electrode on a semiconductor chip, a lead frame, etc.). The capillary 8 is fixed and held to the bonding arm 4 through a means not shown under the state.
申请公布号 JPS6381936(A) 申请公布日期 1988.04.12
申请号 JP19860226024 申请日期 1986.09.26
申请人 HITACHI HOKKAI SEMICONDUCTOR LTD;HITACHI LTD 发明人 NAGANO SOICHI
分类号 H01L21/60 主分类号 H01L21/60
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