| 摘要 |
PURPOSE:To directly detect the propriety of a bonding thereby to be able to prevent an improper bonded state from being erroneously detected by providing a light emitting unit and a photodetector at the opposed positions through a bonding wire, and shielding the light by the wire extended to a bonding point. CONSTITUTION:When a capillary 11 is moved down onto the bonding point 14a of a semiconductor chip 14 and a gold wire 12 is bonded by ultrasonic fusion-bonding to the bonding point 14a, the wire 12 is led from the capillary 11, and extended to the point 14a. When an improper bond occurs in this state, a tension by air for preventing the wire 12 from slacking energizes the wire 12 upward. Thus, a laser light irradiated from a laser irradiating unit 15 through an optical fiber 16 is photodetected by a laser photodetector 18 through a photodetecting optical fiber 19 without being shielded by the wire 12. Thus, light shielding signals Sb1 Sb3 are not output from the photodetector 18: As a result, a CPU 21 detects the improper bond of the wire 12 to the point 12, and stops the following step. |
