VARIABLE SURFACE FLOW VELOCITY TYPE SOLDER TANK

摘要

PURPOSE:To stabilize a soldering work by providing a square tray at the retreating side of a jet nozzle and arranging the roll to remove the oxide film on the solder surface at the lower side of the tray as well. CONSTITUTION:A plane shaped square tray 3 is provided at the retreat side 2b of the jet nozzle 2 opposing to a printed board 1 and the roll 4 intersecting at right angles with the moving direction of the board 1 and conforming to the soldering surface of the inside of the tray 3 at its apex part is arranged at the lower part end of the tray 3 as well. In this case, the roll 4 is rotated in the direction storing an oxide film 5 into a solder tank and its peripheral speed is set so as to nearly conform to the moving speed of the printed board 1. With this method an ideal soldering work is stably performed because of the generating oxide film 5 being recovered to a recovery device 6 by the roll 4 and an adjoint flow being caused on the solder surface as well and its flow velocity conforming to the speed of the board 1.