| 摘要 |
PURPOSE:To prevent the damage and the deterioration in characteristics of elements in a semiconductor chip, by heating locally external electrodes such as a bonding pad and only the wire bonding region of lead terminals by applying a laser gun. CONSTITUTION:One of the bonding pad 3a of a semiconductor chip 3 is heated by a laser beam from a laser gun 5. At the same time, a capillary 2 is moved downward, the ball part of which is pressed against the bonding pad 3a. The capillary 2 is retreated from the pad 3a and moved to an opposing lead terminal 4a to which a wire 1 is to be connected. At the same time the terminal 4a is heated by a laser gun. A middle part of the wire 1 is pressed against the terminal 4a by the capillary 2. Thereby, the damage and the deterioration of characteristics of elements in the chip 3 can be prevented. |
