发明名称 BONDING WIRE
摘要 PURPOSE:To prevent the neck breakage, due to heat cycle, of the titled wire to be obtained and also to facilitate thermocompression bonding and ultrasonic compression bonding to outer lead, by coating a copper-alloy core wire containing specific amounts of Cd with high-purity copper. CONSTITUTION:A copper alloy in which 50-500ppm Cd as a recrystallization- improving element is incorporated to high-purity copper of >=99.99wt% purity is used as a core wire 1, on which a clad 2 composed of high-purity copper of >=99.99% purity is formed in a proper coating ratio. Subsequently, wire drawing and intermediate heat treatment are repeatedly applied to the above, so that a bonding wire A of desired diameter is formed. In this way, tip crack can be prevented when balls are formed by melting a tip at the time of bonding, and neck breakage due to heat cycle can also be prevented.
申请公布号 JPS6379927(A) 申请公布日期 1988.04.09
申请号 JP19860225654 申请日期 1986.09.24
申请人 FUJIKURA LTD 发明人 KUROSAKA AKITO;TOMINAGA HARUO
分类号 C22C9/00;H01B1/02;H01L21/60;H01L23/48 主分类号 C22C9/00
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