发明名称 BONDING WIRE
摘要 PURPOSE:To prevent the neck breakage of the titled wire to be obtained due to heat cycle and also to facilitate thermocompression bonding and ultrasonic compression bonding to outer lead, by coating a copper-alloy core wire containing specific amounts of Bi with high-purity copper. CONSTITUTION:A copper alloy in which 10-100ppm Bi as a recrystallization- improving element is incorporated to high-purity copper of >=99.99wt% purity is used as a core wire 1, on which a clad 2 composed of high-purity copper of >=99.99% purity is formed in a proper coating ratio. Subsequently, wire drawing and intermediate heat treatment are repeatedly applied to the above, so that bonding wire A of desired diameter is obtained. In this way, tip crack can be prevented when a tip is melted to form balls at the time of bonding, and also neck breakage due to heat cycle can be prevented.
申请公布号 JPS6379926(A) 申请公布日期 1988.04.09
申请号 JP19860225653 申请日期 1986.09.24
申请人 FUJIKURA LTD 发明人 KUROSAKA AKITO;TOMINAGA HARUO
分类号 C22C9/00;H01B1/02;H01L21/60;H01L23/48 主分类号 C22C9/00
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