发明名称 CONDUCTOR COMPOSITIONS
摘要 A metallisation compsn. for printing conductor patterns onto a ceramic substrate consists of a mixt. of finely divided particles of (a) 60-98.5 (Pref. 80-97) wt.% conductive metal (e.g. Ag, Cu, Au); (b) 20-1 (Pref. 10-1)% inorganic binder, pref. Pb borosilicate glass; and (c) 20-0.5 (Pref. 10-2)% colourant, consisting of a mixt. of 5-60 wt.% oxide (precursor) of Ag and/or Cu and 95-40% B2O3 (precursor). The colourant does not contain more than 40wt.% Ag oxide or 60% Cu oxide, and is pref. in the form of a powdered frit of metal oxide and B2O3.
申请公布号 KR880000508(B1) 申请公布日期 1988.04.08
申请号 KR19830001560 申请日期 1983.04.14
申请人 E.I. DU PONT DE NEMOURS & CO. 发明人 EUSTIEE, ALBERT L
分类号 H01B5/16;C09K3/18;G11B5/09;H01B1/06;H01B1/16;H05B3/12;H05B3/84;H05K1/09 主分类号 H01B5/16
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