| 摘要 |
PURPOSE:To improve the releasability and dimensional stability by a method wherein transparent liquid epoxy resin composition is fed to a precision metal mold onto which a stamper is provided for thermocompression molding after being semi-cured. CONSTITUTION:Transparent liquid epoxy resin composition is used as the board material. After being semi-cured, the liquid epoxy resin composition is thermocompression-molded. Preferably, the use of resin is determined by taking the cure shrinkage of the resin into consideration. Epoxy resin composition under semi-cured state is normally fed to a precision mold for optical disc board so as to be thermocompression-molded. The molding is done by being compressed under heat by a mold with a mirror surface so as to transfer the fine pattern of an optical disc to an epoxy resin plate and at the same time to completely cure the loard. The completely cured board can be easily released from the mold without adhering to the mold and the stamper. Further, no distortion of the surface of the cured matter due to the cure shrinkage occurs and the board with desired dimensions is accurately obtained. |
