| 摘要 |
<p>A monolithic chip which is suited for a superconductive device. The chip includes a substrate (10) with high (14) and a low (12) temperature region, a superconductive device (24) formed on the low temperature region (12) and various lines for transmitting signals between the device and the high temperature region (14). Various configurations are described for optional separation of the high (14) and low temperature (12) region as well as high (20) and low (18) bandwidth signal lines. Chips can have various geometric substrates.</p> |
