| 摘要 |
<p>PURPOSE:To prevent deformation of a lead terminal of a surface mount type electronic component and enhance the reliability of a soldered area of the lead terminal as well. CONSTITUTION:A lead terminal 2 pulled out from a package main body 1 is formed with a conductive ultra-elastic alloy while a U-shaped bending portion 2a, whose bending angle is acute, is formed in the intermediate part of the lead terminal 2 as well. A greater part of differential thermal expansion between the package main body 1 and a board 3 produced by the drive of an electronic component can be absorbed by elastic deformation of the U-shaped bending portion of the lead terminal 2a, which protects a soldered part 8 from the action of a large stress.</p> |
