| 摘要 |
<p>Material for conductive parts such as a lead frame or a connector of semiconductors or IC and essentially provides an aluminum-base material containing 0.2 to 3.0 % of Mg, 0.2 to 2.0 % of Si, the balance of Al and unavoidable impurities. This material may further optionally contain Cu and/or Zn, and/or one or more of Mn, Cr, Zr, V, and Ni. It is inexpensive and has good softening resistance, electric conductivity, heat conductivity, capabilities of soldering and plating, high mechanical strengths and good repeated bending resistance.</p> |
