Vapor reflow type soldering apparatus

摘要

A vapor reflow type soldering apparatus is provided with a vapor generating tank in which liquefied thermal medium is heated to be converted into vapor. An article or part to be processed is delivered through the vapor generating tank by a conveyor, and a soldering material of the article is heated and molten by the vapor of the thermal medium. The soldering apparatus is further provided with at least one unit or system for introducing the liquefied thermal medium into the vapor generating tank. The liquefied thermal medium is delivered through a pipe provided at a position where heat-exchange between the liquefied thermal medium of the pipe and the high temperature thermal medium is possible to be effected. The liquefied thermal medium is introduced into the vapor generating tank after it has been preheated through the heat exchange with the high temperature thermal medium.