| 摘要 |
<p>An apparatus for cutting a wiring on a printed wiring board using a laser beam includes a laser oscillator for emitting a laser beam along a main optical path, a multiaxis positioning apparatus for changing the three-dimensional coordinates of a printed wiring board, an X-Y adjustment apparatus for adjusting two-dimensional coordinates, perpendicular to the main optical path, an apparatus for optically measuring a size of a wiring to be cut, and a control apparatus for controlling beam parameters of the laser beam in accordance with the measured size.</p> |
