| 摘要 |
PURPOSE:To prevent a wafer from being damaged and to prevent bubbles from being trapped, in a protective tape laminator device used in a semiconductor device manufacturing process, by sticking a protective tape onto the wafer by the pressure of compressed gas. CONSTITUTION:A wafer conveying section 3 is started to move a bed plate 6 carrying thereon a wafer 1 in the direction of the arrow 2, and a protective tape running section 8 is started to run a protective tape 4 in the direction of the arrow 7 by means of an auxiliary roller 10 while a peeled-off tape 4b is wound up onto a roller 10a. Meanwhile, a taper body 4a is led through between the wafer 1 and a pressing member 11, and is pressed against the wafer 15 by compressed air fed through an air passage 14 and jetted downward from a plurality of passage holes 15. Accordingly, the protective tape 4 is stuck onto the outer surface of the patterned wafer 1 under uniform pressing force. Therefore, the protective tape may be stuck without the wafer being damaged and without air bubbles being trapped, and accordingly it is possible to enhance the yield and reliability of the semiconductor device. |
