发明名称 MOUNTING BOARD FOR SEMICONDUCTOR CHIP
摘要 PURPOSE:To enrich wide usefulness and to improve working efficiency, by using a porous material on a position where a mounting surface is formed in a mounting board on which a semiconductor chip is fixed on the mounting surface by the use of an attracting action. CONSTITUTION:A pellet 2 is mounted on a mounting table 12 of a mounting board 10 by the use of a collet. A vacuum source 15 is connected to a chamber 13 through a pipe 14. The whole rear surface of a pellet 2, which is mounted on a mounting surface 12a of a mounting table 12 made of porous ceramics or sintered alloy, is attracted to the mounting surface 12a by an attracting action. The pellet 2 is gripped by V grooves of positioning pawls 5 approaching to each other so that positioning of the pellet is performed, and again the pawls are left apart. The pellet 2 finished to be positioned is attracted by the use of the collet. Thus, because the rear surface of the pellet 2 is uniformly attracted no rotational shift occurs. Even if a size of the pellet 2 is changed, the mounting board 10 is not required to be exchanged. Therefore, wide usefulness can be enriched and working efficiency can be improved.
申请公布号 JPS6372139(A) 申请公布日期 1988.04.01
申请号 JP19860216686 申请日期 1986.09.12
申请人 TOSHIBA SEIKI KK 发明人 SUZUKI HISAYA
分类号 H01L21/683;H01L21/52;H01L21/68 主分类号 H01L21/683
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