发明名称 SUPERSONIC WIRE BONDING
摘要 PURPOSE:To enable bonding of a wire orientated in all directions, by using a flexible member to form a cavity oscillated by supersonic waves and vibrating a capillary so as to be deformed and converting the vertical vibration into the orthogonal vibration, so that the capillary is vibrated in all circumferential directions. CONSTITUTION:Against a bonding position of a pellet 19 on a frame 18 attracted by an attracting pad 15 on a table position-controlled by a controller, a supersonic oscillating device 3 is operated in a state where a capillary 9 touches the device through a wire 12, and the capillary 9 is vibrated through a horn 5 in the direction of an arrow B. A pointed end of the capillary 9 touches a pad 22 of the pellet 19 through the wire 12 and it is repeatedly deformed in the direction of an arrow C. Thus the wire 12 is vibrated by the capillary 9 aud a bonding operation is completed. Hence, using the capillary enables the vibration to be orthogonally changed in the circumferential directions and makes the wire be vibrated to perform the bonding operation, and so the wire can be connected in all directions and bonding-work hours can be shortened.
申请公布号 JPS6372135(A) 申请公布日期 1988.04.01
申请号 JP19860215738 申请日期 1986.09.16
申请人 HITACHI LTD 发明人 MITA TORU;TAKAHASHI MICHIRO;ARAI SHINICHI;OZAWA MASAKAZU;TANI MITSUKIYO
分类号 H01L21/607;H01L21/60 主分类号 H01L21/607
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