发明名称 MOLD DEVICE FOR INJECTION COMPRESSION MOLDING
摘要 PURPOSE:To reduce heat transfer between a frame and an inserted block and also reduce heat dissipation out of resin in a subrunner by providing a heat insulation section on the opposing surface of the inserted block of a cavity and a fixed mold and a movable molds supporting the inserted block, and reducing the section area (or diameter) of the sub-runner. CONSTITUTION:The contact areas of an inserted block 4 on the fixed side with a fixed frame l and a template 6 on the fixed side are reduced by recessed sections 8 and 9 and a space 10, and contact areas of a sleeve 12 on the movable side with a frame 11 on the movable side and a template on the movable side are reduced by recessed sections 21 and 22 and a space 23, and further the contact areas of an inserted block 13 with a pressurizing cylinder 20 are reduced by a recessed section 24, down to 20-30% of the original contact area respectively. The section area of a sub-runner 26 formed between an inserted block 4 on the fixed side and the sleeve 12 on the movable side is reduced by 50 % or more of the section area of a runner 25, and heat dissipation out of resin in the sub-runner 26 is reduced to increase significantly axial symmetrical properties of the molding temperature.
申请公布号 JPS6371324(A) 申请公布日期 1988.03.31
申请号 JP19860215748 申请日期 1986.09.16
申请人 HITACHI LTD 发明人 MARUYAMA TERUNORI;ARAI YOICHIRO
分类号 B29C45/26 主分类号 B29C45/26
代理机构 代理人
主权项
地址