| 摘要 |
PROBLEM TO BE SOLVED: To obtain a package capable of minimizing the warping level at a specific normal temperature by specifying the setting shrinkage coefficient at the temperature within a specific range while setting up the thermal expansion coefficient having the characteristics within a specific range at the normal temperature. SOLUTION: A resin composition composed of epoxy resin, phenol resin setting agent, 78-93wt.% of inorganic filler to 100% of the whole composition and an accelerator as the essential components so that the setting body of the resin composition may be characterized by the setting shrinkage coefficient of 0.15% and the thermal expansion coefficient of 0.8×10<-5> -1.5×10<-5> /C deg.. Through these procedures, a package for ball grid array in the minimum warping at -65 deg.C-240 deg.C can be obtained thereby enabling the package to be provided with less defectives in the temperature cycle test, causing less troubles in the packaging step and the high reliability.
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