发明名称 |
TAPE FOR TAPE-AUTOMATED-BONDING OF INTEGRATED CIRCUITS AND METHOD OF PRODUCING THE TAPE |
摘要 |
<p>A tape for use in tape-automated-bonding of integrated circuits is disclosed. A series of interconnection arrays ("frames") are arranged along the tape, each array being formed by a number of interconnection beams 3. A terminal ("bump") 6 is located on each beam 3 for bonding to a respective interconnection pad 7 of an integrated circuit 8. Conventional bumps are made of gold-plated copper and have uneven and unyielding bonding surfaces which can fail to provide consistent bonds. The bumps 6 of the tape disclosed comprise a conductive material having a Vickers hardness number of 55 or less, and thus have a compliance which facilitates more even bonding. A method of producing the tape is also disclosed.</p> |
申请公布号 |
EP0070691(B1) |
申请公布日期 |
1988.03.30 |
申请号 |
EP19820303716 |
申请日期 |
1982.07.15 |
申请人 |
BRITISH TELECOMMUNICATIONS PUBLIC LIMITED COMPANY |
发明人 |
SINNADURAI, FRANCIS NIHAL;SMALL, DAVID JOHN;BLAIN, ALEXANDER ANTHONY;COOPER, KENNETH |
分类号 |
H01L21/48;H01L21/60;H01L23/495;H05K3/40 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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