| 摘要 |
A semiconductor device includes a power line (13) and sub power line (16) pair therein, both lines connected to the same power source. The power line is located on a layer under which a peripheral circuit region, such as input/output buffer circuits and output buffer circuits, is arranged in a semiconductor substrate. The sub power line is located above and electrically shorted with the power line. The electric shorts are formed, at least, at portions under which the output buffer circuits are located and connected to the power line. |
