发明名称 MOLDING DEVICE FOR SYNTHETIC RESIN MOLDED FORM
摘要 PURPOSE:To uniform the thickness of the layer of a molding surface, by a method wherein a movable mold member, provided in one part of a mold for molding the molding surface, is advanced and retreated. CONSTITUTION:A female mold 2 is moved upward by the elevating operation of an elevating device whereby a gap of 3-4mm is formed between the base body B of a molded form, molded already in a cavity 3, and a male mold 1. At this time, a movable mold member 4, annexed to the female mold 2, is retreated by 3-4mm to an imaginary line on a diagram by the contracting operation of a hydraulic pressure cylinder 5 and the extending operation of the hydraulic pressure cylinder 11. Then, a second synthetic resin molding material is injected to fill a gap between both molding surfaces 1a and 4a corresponding to the flange (a1) of a molded form. Thereafter, the female mold 2 is descended to clamp the molds and, at the same time, the movable mold member 4 is advanced to a full line on the diagram by the extending operation of the hydraulic pressure cylinder 5 and the contracting operation of the hydraulic pressure cylinder 11. Finally, the molds are pressurized and heated whereby the molded form A, in which the second synthetic resin is coated on the upper surface of the base body B of the molded form, may be obtained.
申请公布号 JPS6369611(A) 申请公布日期 1988.03.29
申请号 JP19860213061 申请日期 1986.09.10
申请人 MAZDA MOTOR CORP 发明人 ODA MASAMITSU
分类号 B29C45/14;B29C45/16;B29C69/02;B29K67/00;B29K75/00;B29K105/08;B29L9/00 主分类号 B29C45/14
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