| 摘要 |
A method of manufacturing a semiconductor device (20) having at least one selectively actuable conductive link (34), and a semiconductor device so produced, enables circuit elements (22,24) to be closely packed on a semiconductor substrate (26). An electrically conductive semiconductor link (34) is formed to join two circuit elements (22,24), but a non-conductive region (44) within the link (34) prevents their electrical connection. The non-conductive region (44) can be amorphous such that the application of an energy beam (48) thereto recrystallizes the region (44) and activates the electrical connection. The link between the two circuit elements (22,24) can be made without bulk material movement. |
