| 摘要 |
<p>PURPOSE:To elongate the life of dicing blade by a method wherein, when semiconductor wafers are sticked on adhesive sheet for dicing to be separated on each pellet, the first sheet material comprising the first adhesive layer on the surface and the second adhesive layer with adhesion higher than that of the first adhesive layer on the backside is utilized and the wafers are sticked on the first adhesive layer while the second sheet material with high extensibility is sticked on the second adhesive layer. CONSTITUTION:The layer 14 side of the first sheet material 11 with low extensibility comprising the first adhesive layer 13 and the second adhesive layer 14 respectively on the surface and the backside is sticked on the second sheet material 12 with high extensibility. At this time, the adhesion of the second adhesive layer 14 is made higher than that of the first adhesive layer 13. If acrylic base adhesive is utilized for an adhesive layer, the adhesion may be changed by changing the ratio of each constituent. Later, a semiconductor wafer 15 may be sticked on the layer 13 and the sheet material 11 is half cut using a blade to blow off the cut pellets 15a by means of blowing air on the backside of the sheet material 12 for vibration.</p> |
