| 摘要 |
PURPOSE:To strengthen the connection between copper wires and stitch parts on which wire bonding of a lead frame is performed, by coating the stitch parts with zinc. CONSTITUTION:Zinc plated layers 3 are formed through copper plated layers 2 on the surface of stitch parts, on which wire bonding of a lead frame base material 1 is performed, in a lead frame for copper wire bonding. As a result, the zinc layers coating the stitch parts are made to function as alloy diffusing reaction layers to copper, and alloy layers consisting of copper wires and zinc on the stitch parts are formed even if the copper wires are a little oxidized due to heat conveyed from a work stage, so that solid connection parts can be formed. |
