| 发明名称 |
Thermocompression bonding of copper leads to a metallized ceramic substrate |
| 摘要 |
Copper leads having an average grain size from 0.035 to 0.055 mm are thermocompression bonded to a metallized portion of a ceramic substrate. Surprisingly, such large grain size substantially decreases the "ceramic pullout" of the bonded leads. |
| 申请公布号 |
US4734753(A) |
申请公布日期 |
1988.03.29 |
| 申请号 |
US19860921908 |
申请日期 |
1986.10.27 |
| 申请人 |
AMERICAN TELEPHONE AND TELEGRAPH COMPANY;AT&T TECHNOLOGIES, INC. |
发明人 |
CRANSTON, BENJAMIN H.;HUNSBERGER, RICHARD L.;MACHUSAK, DONALD A. |
| 分类号 |
H01L21/48;H01L23/495;(IPC1-7):H01L23/50 |
主分类号 |
H01L21/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
