| 摘要 |
<p>PURPOSE:To facilitate a test by a sole LSI and a screening by providing a carrier having electrodes to which an LSI chip can be bonded and connecting by wire bonding the carrier to a multilayer substrate. CONSTITUTION:An LSI chip 3 is disposed on a carrier 2, and the leads 31 of the chip 3 are thermally press-bonded onto connecting electrodes 21. Then, the chip 2 mounted on the carrier 2, tested and sorted is disposed on a multilayer substrate 1, and connected by interconnections 4 to the electrode 17 of the substrate 1 corresponding to the electrodes 21 of the carrier 2 by wire bonding to form a predetermined circuit functions. Since a signal layer 18 is formed of an organic insulator having low specific dielectric constant, a fast signal propagation velocity is obtained. The carrier 2 is connected to the substrate 1 by fine interconnections 4 having 20-30mumphi in diameter. Accordingly, it can be sufficiently bonded to the electrodes 17 on a polyimide insulator 16.</p> |
