发明名称 METHOD OF TREATING SURFACE OF POLYIMIDE MOLDING
摘要 <p>PURPOSE:To obtain easily a polyimide molding having a surface with excellent adhesive properties, by treating the surface of the molding with a basic compd. and then with a silane coupling agent and heat-treating it. CONSTITUTION:The surface of a polyimide molding such as a polyimide film, a polyimide laminate, etc. is treated with a soln. contg. a basic compd. (e.g., sodium hydroxide, tetramethylammonium hydroxide) and then with a silane coupling agent (e.g., gamma-mercaptopropyltrimethoxysilane, gamma- aminopropyltriethoxysilane), e.g., by immersing it therein. The product is heat- treated at 80 deg.C or higher to improve the adhesion of the surface of the molding.</p>
申请公布号 JPS6368641(A) 申请公布日期 1988.03.28
申请号 JP19860211849 申请日期 1986.09.09
申请人 HITACHI CHEM CO LTD 发明人 MATSUURA SHUICHI;MIYADERA YASUO
分类号 C08J7/00;B05D3/10;B32B27/34;C08J7/04;C08J7/06;C08J7/12;H05K3/38 主分类号 C08J7/00
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