发明名称 SEMICONDUCTOR MANUFACTURING DEVICE
摘要 PROBLEM TO BE SOLVED: To keep constant the frictional state between a semiconductor substrate and an abrasive cloth by providing a mechanism for changing load so that the torque current value is constant. SOLUTION: The frictional state between a semiconductor substrate 1 and an abrasive cloth 4 is transmitted to a motor part 7 connected to a base plate 3. By a torque current conversion monitor mechanism 8 provided in such a manner that the torque current extracted from the motor part 7 connected to the base plate 3 is always constant, a difference between the preset torque current and the obtained torque current value is calculated, and transmitted to a load converter 9 for controlling what load is applied to the semiconductor substrate 1. The load value to a support plate 2 is changed to keep constant the frictional state between the semiconductor substrate 1 and the abrasive cloth 1.
申请公布号 JPH1199467(A) 申请公布日期 1999.04.13
申请号 JP19970262107 申请日期 1997.09.26
申请人 NEC KYUSHU LTD 发明人 IKEYAMA KAZUTAKA
分类号 B24B37/005;H01L21/304 主分类号 B24B37/005
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