| 摘要 |
PURPOSE:To establish a more reliable connection between a circuit body inner lead section and semiconductor chip by a method wherein a recess is provided on a metal mold core section at locations where a portion of an circuit body inner leads is wire-bonded to a semiconductor chip to be installed in a chip installation section. CONSTITUTION:A supporting member 17 is positioned secure when it is accommodated in a recess 23 provided in a bottom force 1a. In this way, a pin 4, a circuit body 3, and the supporting member 17 are set in the bottom force 1a, after which they are clamped between the top force 1b and bottom force is of a metal mold 1. Thus clamped in the metal mold 1, the circuit body 3 is fixed immovable, sandwiched between a core section 5 and the supporting member 17, with the lower face of the core section 5 abutting under pressure against the upper surface of the periphery of a chip installation section 2 of the circuit body 3. A groove-geometry recess 10 is provided along the entire periphery of the lower surface of the core section 5 and the gold-plated portion of the periphery of the chip installation section 2 is so set as to face the groove- geometry recess 10, protecting the gold-plated portion from collapse under pressure of the core section 5. |
