发明名称 THERMOPLASTIC RESIN COMPOSITION
摘要 PURPOSE:To obtain a thermoplastic resin composition having excellent cleaning effect and suitable for the cleaning of a molding machine in the change-over of grades in plastic molding process, by compounding a neutral salt of an organic sulfonic acid and a powdery inorganic compound having specific particle diameter to a base resin. CONSTITUTION:A thermoplastic resin (e.g. polyethylene) is compounded with (A) 2-30wt% one or more sulfonic acid neutral salts selected from alkylbenzenesulfonic acid sodium salt having 6-20C alkyl group, alkylsulfonic acid sodium salt having 8-20C alkyl group and sodium salt of a sulfosuccinic acid diester of a 6-16C alcohol and (B) 0.05-5wt% powdery inorganic compound having particle diameter of 0.005-10mum (e.g. silicon dioxide, diatomaceous earth, etc.).
申请公布号 JPS6366245(A) 申请公布日期 1988.03.24
申请号 JP19860210855 申请日期 1986.09.08
申请人 CHISSO CORP 发明人 FUJII HIROYUKI;KUDO TAKAMICHI;YAMAMOTO SHINSUKE
分类号 C08K3/30;C08K3/28;C08K7/16;C08K7/18;C11D1/12;C11D1/28;C11D7/02;C11D7/22;C11D10/02;C11D17/00 主分类号 C08K3/30
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