| 摘要 |
A double-mitre sawing apparatus for cutting profiles to size, in particular profiles for windows and door frames, is provided with a supporting surface for supporting the profile to be sawn, and also with two sawing assemblies which are pivotable and arranged such that the distance between them can be varied and in each case have a circular saw blade, and with an actuable clamping device for clamping the profile on the supporting surface. The supporting surface is arranged horizontally and the circular saw blades of the sawing assemblies in sawing planes perpendicular to the supporting surface. The sawing assemblies are arranged pivotably about vertical pivoting axes which in each case coincide with axes of symmetry of the circular saw blades, and each circular saw blade can move up and down in the longitudinal direction of its pivoting axis in order to saw through the profile. There is provided at least one positioning member, which determines the course of the profile situated on the supporting surface at a third point outside the points of intersection of straight lines indicating the course of the pivoting axes of the circular saw blades with the supporting surface.
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